IC Chips Grinding Repair Machine for iPhones iPads Main Board Motherboard Repair
1. Compatible with: iPhone
2. Function: IC Chips Grinding Repair
3. Weight: about 60kg
1 x Operating PC
1 x CNC Machine
1 x CNC Controller
1 x Milling cutters
1 x LED Lamp
1 x Cooling Pump
13 x Mould for iPhone 5S/6/6P6S/6SP/7/7P/8/8P/X/XS/XR/XS MAX
Tips: The procuct prevails in kind.
CNC Chip Grinding Machine Features
Chips are difficult to be removed, since solder balls are easily melted while glues are not. With CNC
Chip Grinding Machine, chip removing can be quick and safe without damaging the board.
CNC Chip Grinding Machine is designed to grind and remove a variety of chips, covering both iPhone
series and iPad series with respective molds and programs supporting unlimited upgrading.
1. Wire Connecting
(1) CABLE CONNECTING
Connect the USB LPT interface of the controller with Operating PC. Connect the spindle interface of the
controller with the grinding machine. Connect the engraving machine interface of the controller with the
grinding machine. Connect the Operating PC with the monitor via VGA wire. Connect the water pipe of
the grinding machine with the cooling pump.
(2) WIRE UP
Wire up the controller, the monitor, the Operating PC, the light lamp. Get the wire-less keyboard and
mouse prepared. Wire up the cooling pump. Turn on the power switch of the controller. Turn on the
power button of the monitor. Turn on the power button of the Operating PC. Turn on the e-stop switch
by rotating clockwise.
2. Grinding Preparing
Open the software. On the software interface, click on the left mouse button and select ‘Operation’.
Click on the left mouse button and select ‘Move to Reference Point’ (The process goes with the per
powering up of the grinding machine).
On the pop-up window, select ‘All Axes’ and wait for the grinding machine to move back to the
original position of coordinates. After that, close up the pop-up window. Click and clear numerical
value of X-axis and Y-axis.
3. Grinding Demonstrating – iPhone 6 Audio Chip Grinding
In the manual mode, move the milling cutter of the grinding machine to the corresponding chip
grinding area by clicking the control button of X-axis and Y-axis.
Put the iPhone 6 logic board on the corresponding iPhone 6 area. Replace with a new milling
cutter when needed. Then fix the logic board to the mold.
On the software interface, click on the file icon. On the ‘Open and load’ window, select ‘iPhone 6
Audio. nc’. Then start the Spindle.
In the manual mode, move the milling cutter of the grinding machine to the corresponding audio
chip grinding area by clicking the control button of X-axis,Y-axis and Z-axis. Click the ‘start’ icon
on the software interface, or click ‘F9’ to start grinding.
Click the ‘stop’ icon on the software interface, or click ‘F11’ to stop grinding. On the blank area of
the software interface, click on the right mouse button. On the pop-up window, adjust numerical
value of Z-axis based on the actual situation.
After that, click the ‘start’ icon on the software interface, or click ‘F9’ to restart grinding. Once the
welding spot comes out, stop the grinding process. Clear up chip residue and clean with PCB cleaner.
Evaluate grinding effect to see if the grinding process is successful.